The Hong Kong Electronic Industries Association and Kapok Capital Sign MOU — A Major Step Forward in Innovation, Investment, Industrial Chain, and Brand Development

The Hong Kong Electronic Industries Association (HKEIA) and Kapok Capital signed a Memorandum of Understanding (MoU) on August 6, 2025. The MoU was signed by Mr. Basil Wai, Chief Executive Officer of the HKEIA, and Ms. Wang Xiaoxia, Partner of Kapok Capital, under the witness of Mr. Paul So, Chairman of the HKEIA, and Dr. Raymond Leung, Chairman and Co-founder of Kapok Capital. This collaboration marks a significant step forward in the areas of innovation and technology, investment, industrial chain development, and brand building.

#HKEIA #KAPOK Cap;ital #MOU

HKEIA and Kapok Capital signed a Memorandum of Understanding (MoU) on August 6, 2025.

Mr Paul So, Chairman of HKEIA delivered welcoming speech

Ms. Wang Xiaoxia, Partner of Kapok Capital presents at the sharing session

Dr. Raymond Leung, Chairman and Co-founder of Kapok Capital presents at the sharing session