HKEIA signed MOU with HKAIIA and HKBPA

On September 11, 2025, the Hong Kong Electronic Industries Association (HKEIA) held two Memorandum of Understanding (MoU) signing ceremonies — one with the Hong Kong Association of Artificial Intelligence and Innovation (HKAIIA) and another with the Hong Kong Brand Protection Alliance (HKBPA).

Before the ceremonies, Mr. Paul So, Chairman of the HKEIA, delivered a welcome speech to the guests. The first signing ceremony was witnessed by Mr. Chris Tse, Chairman of HKAIIA, and Mr. Paul So, Chairman of the HKEIA. The MoU was signed by Mr. Luther Wong, JP, Executive Vice President of HKAIIA, and Mr. Basil Wai, CEO of the HKEIA.

The second signing ceremony was between rthe HKEIA and HKBPA. The MoU was signed by Mr. Basil Wai, CEO of the HKEIA, and Mr. Benny Kong, incoming Chairman of HKBPA, under the witness of Mr. Paul So, Chairman of the HKEIA, and Dr. Dennis Ng, SBS, BBS, MH, Honorary Chairman of HKBPA.

This collaboration is expected to mark a significant step forward in innovation, technology, and brand development.