City University of Hong Kong (CityU) – Department of Electrical Engineering (EE) and five technology organizations including Hong Kong Electronic Industries Association (HKEIA), Automotive Platforms and Application Systems R&D Centre (APAS), Electrical and Mechanical Services Department (EMSD), Hong Kong Applied Science And Technology Research Institute Company Limited (ASTRI) and Hong Kong Productivity Council (HKPC) announced the establishment of five CityU EE Joint Labs on 19 September 2019.
CityU EE Joint Lab is a “Government-Industry-Academic-Research Centre” scheme for collaboration between EE Department and industrial associations, research centres, corporates and organisations. This scheme includes physical lab logo wall setup in the EE Department; an online platform linked up with the EE Department website to share the progress of collaboration and projects; a series of regular networking events for industrialists, faculty members, and students, etc. The Joint Lab aims to empower recruitment, research collaboration, commercialisation, and technology transfer.
An opening ceremony was held on CityU campus for five Joint Labs. Prof. Stella Pang, Department Head of EE, CityU; together with Dr. Lawrence Poon, General Manager of APAS; Mr Hugh Chow, CEO of ASRTI; Mr. CK LEE, Assistant Director (Acting) of EMSD; Dr CH Ng, Chairman of HKEIA; and Dr. Lawrence Cheung, CIO of HKPC launched the Opening of the five CityU EE Joint Labs.
Prof Stella Pang, Department Head of EE said, “We are excited to partner with so many industrial organisations to work together as a team to drive Hong Kong technology. I am sure CityU EE Joint Lab can help to train our students to contribute to the industry through different collaboration projects. Moreover, the developed technology through the Joint Lab Scheme can be commercialised and transferred to industry partners and government stakeholders.”
Leveraging on CityU EE’s strong research capabilities in 14 research themes including Antenna design; Big data, Machine Learning and Artificial Intelligence; Bioinformatics; Biomedical system; Biosensors, Bioelectronics; Computer Engineering; Control System and Optimisation; Microelectronic Devices and Circuits; Nanotechnology and Nanodevices; Networking and Internet of Things (IoT); Photonics, Power electronics and Systems; Signal and Image Processing; Terahertz and Millimeter Waves; Wireless Communications; a series of collaboration and technology initiatives will be carried out under the CityU EE Joint Lab Scheme.
With APAS, ASTRI, EMSD, HKEIA, and HKPC’s strong R&D and industrial network, CityU EE’s world-class researchers and five partners’ industrial experts will work together to drive university research to commercialisation and daily life applications especially in HK to the world.
The CityU EE Joint Lab Ceremony will be scheduled to be held quarterly. Maximum six Joint Labs will be established in each round. There will be six technology companies joining the next round in December 2019. Additionally, the progress of projects and collaboration will be shared in the seminar in the ceremony.
