HKEIA Activities
Visit to the Reliability Testing Centre of the HKPC and GMN 2 Kick-off Ceremony
To help local industry develop high reliability electronic products, the HKPC & HKEIA co-organize a visit to a new Reliability Testing Centre in the HKPC for our members on 9 May 2011.
Reflow Simulation is one of the reliability tests to simulate thermal stress effect during reflow soldering of electronics assemblies. It is often required as a pre-requisite in large multi-layer count PCB thermal resistance testing in meeting the qualification standards of large multi-national companies.
With the support from the SME Development Fund of the Trade and Industry Department of HKSAR Government, HKPC upgrade its Reliability Testing Centre and acquired an advanced High Reliability Reflow Simulation System which has various heating and cooling zones to simulate the stringent testing requirements. Local SME's can now enjoy a free-of-charge service from April 2011 to March 2014 on a first-come, first-served basis. This is a golden opportunity for companies to leverage the service to move up the value ladder in the high-end PCB market.
For more information on the Reliability Testing Centre, please click here.
If you are interested in the free-of-charge service of High Reliability Reflow Simulation System, please click here for more information.
Besides, "Project MAX" was launched at the GMN 2 Kick-off Ceremony. "Project MAX" is co-initiated by the Hong Kong Productivity Council (HKPC) and the Hong Kong Electronic Industries Association (HKEIA) and powered by Michelin. The objective of the project is under the goal of "A Solution for Industries to Achieve Partner Synergy for Business Growth" which aims to enhance business opportunities for the local industries through partner synergy. Please click here for more information.
