本會活動

Seminar on "Characterisation Methods for Printed Circuit Board (PCB) Industry"

The Hong Kong Science & Technology Parks (HKSTP) & the Hong Kong Electronic Industries Association (HKEIA) co-organized a Seminar on "Characterisation Methods for Printed Circuit Board (PCB) Industry" at the HKSTP on 7 January 2011.

The seminar gave participants a better understanding on and investigating root causes of product failure, maintaining quality assurance and supporting research and development study in Printed Circuit Board (PCB) industry by the effective use of analysis and material characterisation techniques.

We have invited 2 professional speakers:

1. Professor Winco Yung has over 26 years experience in both academia and industry with engineering and management responsibilities. He is currently an Associate Professor in the Department of Industrial and Systems Engineering (ISE) at The Hong Kong Polytechnic University.
2. Dr. Cindy XI obtained her MPhil and PhD in Physics from Peking University and The Chinese University of HongKong, respectively. She spent two years as a postdoctoral scholar in a consulting and research laboratory, Surface Science Western (SSW) at the University of Western Ontario, specialising in the analysis and characterisation of surfaces and materials.

Over 60 attendants join the seminar

Professor Winco Yung shares PCB Lamination Technology with a topic "Characterization of Printed Circuit Board material(e.g. laminate) and quality assurance"

Mr. Raymon Chan, Technical Consultant, Material Analysis Laborantory of HKSTP(left) and Ms. Trace Chan, Head, Membership & Promotion Dept. of the HKEIA present a souvenir to Professor Yung

Dr. Cindy XI,Engineer, Material Analysis Laboratory, HKSTPC presents topic "Applications of surface analysis techniques including SEM/EDX, AES, XPS, TOF�]SIMS, Surface profilometer, AFM, FTIR and XRF for PCB industry"